Call For Papers (Download CFP)

The Microsoft CMT service was used for managing the peer-reviewing process for this conference. This service was provided for free by Microsoft and they bore all expenses, including costs for Azure cloud services as well as for software development and support.

Scope And Overview

5th International Conference on Emerging Technology Trends in Electronics, Communication and Networking (ET2ECN 2026) is soliciting original and previously unpublished papers addressing research challenges and advances in the areas of Electronics, Communication and Networking sys-tems. The objective of the conference is to provide an opportunity for researchers, academicians and students to discuss and exchange ideas on issues, trends, and developments in Electronics, Communication and Networking. The ET2ECN 2026 conference takes a broader view and seeks papers describing innovative research contributions to the broad field of Electronics, Communication and latest as well as upcoming technologies.

Call For Papers

Researchers, Academicians and Professionals are invited to submit a full length paper at the technical sessions of ET2ECN 2026. Papers that present original work, validated by experimentation, simulation, or analysis, are solicited. Practical experiences and experimental efforts from both industry and academia, duly documenting the lessons learned from testbeds, field-trials, or real deployments, are also welcome. The multi-thematic program of this conference will focus on topics and technical areas of interest include but are not limited to as shown in tracks.

Track I
(Communication Systems & Networks)
  • Wireless Communication
  • 5G & Beyond Communications
  • Channel Modelling & Analysis
  • Finite & Infinite Blocklength Transmissions
  • Optical Fibre and Photonic Communication
  • Vehicle to Vehicle Communication
  • Network Architectures
  • Software Defined Networking
  • Next Generation Internet
  • Ad hoc and Sensor Networks
  • Use of AI/ML in Signal Processing
Track II
(VLSI)
  • VLSI Circuits and Systems
  • Low Power Design Techniques
  • CAD Tools and Methodologies
  • FPGA/ASIC Design
  • Testing and Verification in VLSI
  • Emerging Devices and Technologies in VLSI
Track III
(Embedded Systems)
  • Intelligent Sensor Networks for Monitoring and Diagnosis
  • Sensor Networks in Automotive
  • On body Sensor Networks
  • IoT and Applications
  • Security Issues in IoT
  • Cloud Computing
  • Control and Dynamic Systems
  • Real time Operating Systems for Embedded Systems
  • Hardware Software Co design
Track IV
(RF and Microwave)
  • Antennas and Propagation
  • RF Circuit Design
  • Microwave Devices and Components
  • Millimeter wave and Terahertz Technologies
  • EM Simulation and Modeling
  • Reconfigurable and Smart Antennas
  • Metamaterials for RF/Microwave Applications
Track V
(Fabrication and Packaging)
  • Semiconductor Device Fabrication
  • Nanoelectronics and Nanotechnology
  • MEMS and NEMS Design and Fabrication
  • 3D ICs and Advanced Packaging
  • Wafer Level Packaging
  • Reliability and Thermal Management in Packaging
  • Materials for Fabrication and Packaging
Track VI
(Signal Processing)
  • Image / Video Processing for Autonomous Vehicles
  • 3D Image / Video Processing
  • Image Enhancement / Super Resolution / Restoration
  • Action & Event Detection / Recognition
  • Medical Image & Video Analysis
  • Remote Sensing
  • Hyperspectral Image Processing
  • Speech and Audio Signal Processing
  • Multirate and Multidimensional Signal Processing
  • Machine Learning for Signal Processing